Thermal via placement in 3D ICs

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Authors: Brent Goplen University of Minnesota, Minneapolis, MN
Sachin Sapatnekar University of Minnesota, Minneapolis, MN
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· Proceeding
ISPD '05 Proceedings of the 2005 international symposium on Physical design
Pages 167-174
ACM New York, NY, USA ©2005
table of contents ISBN:1-59593-021-3 doi>10.1145/1055137.1055171
Thermal via placement in 3D ICs Published by ACM 2005 Article
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· Citation Count: 37


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