Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration

Full Text:

Pdf

Buy this Article

Authors:	Zuoyuan Li	Tsinghua University, Beijing, China
	Xianlong Hong	Tsinghua University, Beijing, China
	Qiang Zhou	Tsinghua University, Beijing, China
	Jinian Bian	Tsinghua University, Beijing, China
	Hannah H. Yang	Intel, USA, Hillsboro, OR
	Vijay Pitchumani	Intel, USA, Hillsboro, OR

	2006 Article
Bibliometrics
· Downloads (6 Weeks): 2 · Downloads (12 Months): 36 · Downloads (cumulative): 548 · Citation Count: 4

Published in:

· Journal

ACM Transactions on Design Automation of Electronic Systems (TODAES) TODAES Homepage archive

Volume 11 Issue 2, April 2006
Pages 325 - 345
ACM New York, NY, USA
table of contents doi>10.1145/1142155.1142159

Tools and Resources