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Entering the hot zone: can you handle the heat and be cool?

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Authors: A. Yang Apache Design Solutions
R. Chandra Gradient Design Automation
S. Burke ATI Technologies
J. A. DeLaCruz eSilicon Corporation
S. Santhanam P.A. Semi
U. Ko Texas Instruments Inc.
Entering the hot zone: can you handle the heat and be cool? Published by ACM 2006 Article
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· Proceeding
DAC '06 Proceedings of the 43rd annual Design Automation Conference
ACM New York, NY, USA ©2006
table of contents ISBN:1-59593-381-6 doi>10.1145/1146909.1146957

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