SIGN IN
SIGN UP
The importance of adopting a package-aware chip design flow
Full Text:
PDF
Buy this Article
Authors:
Kaushik Sheth
Rio Design Automation, Santa Clara, CA
Egino Sarto
Rio Design Automation, Santa Clara, CA
Joel McGrath
Rio Design Automation, Santa Clara, CA
Published in:
· Proceeding
DAC '06
Proceedings of the 43rd annual Design Automation Conference
Pages 853-856
ACM
New York, NY
, USA
©2006
table of contents
ISBN:1-59593-381-6
doi>
10.1145/1146909.1147127
2006 Article
Bibliometrics
· Downloads (6 Weeks): 1
· Downloads (12 Months): 12
· Downloads (cumulative): 173
· Citation Count: 3
Tools and Resources
Buy this Article
Request Permissions
TOC Service:
Email
RSS
Save to Binder
Export Formats:
BibTeX
EndNote
ACM Ref
Upcoming Conference:
DAC '13
Share:
|
Tags:
algorithms
chip
co-design
concurrent
design
experimentation
exploration
flip chip
i/o
package
prototyping
rdl
routing
standardization
substrate
synthesis
verification
Feedback
|
Switch to
single page view
(no tabs)
**Javascript is not enabled and is required for the "tabbed view" or switch to the
single page view
**
Powered by
The ACM Guide to Computing Literature
All Tags
Export Formats
Save to Binder