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Yield prediction for 3D capacitive interconnections
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Authors:
A. Fazzi
ARCES-University of Bologna, Bologna, Italy
L. Magagni
ARCES-University of Bologna, Bologna, Italy
M. De Dominicis
ARCES-University of Bologna, Bologna, Italy
P. Zoffoli
ARCES-University of Bologna, Bologna, Italy
R. Canegallo
FTM-STMicroelectronics, Agrate Brianza, Italy
P. L. Rolandi
FTM-STMicroelectronics, Agrate Brianza, Italy
A. Sangiovanni-Vincentelli
University of California - Berkeley, CA
R. Guerrieri
ARCES-University of Bologna, Bologna, Italy
2006 Article
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Published in:
· Proceeding
ICCAD '06
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Pages 809-814
ACM
New York, NY
, USA
©2006
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ISBN:1-59593-389-1
doi>
10.1145/1233501.1233667
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Tags:
design
design aids
interconnections
performance
performance analysis and design aids
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