From 3D circuit technologies and data structures to interconnect prediction

doi:10.1145/1572471.1572485

From 3D circuit technologies and data structures to interconnect prediction

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Authors:	Robert Fischbach	TU Dresden, Dresden, Germany
	Jens Lienig	TU Dresden, Dresden, Germany
	Tilo Meister	TU Dresden, Dresden, Germany

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	· Proceeding
	SLIP '09 Proceedings of the 11th international workshop on System level interconnect prediction
	ACM New York, NY, USA ©2009 table of contents ISBN: 978-1-60558-576-5 doi>10.1145/1572471.1572485

	2009 Article Invited talk
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Tags: 3d floorplanning 3d integration advanced technologies algorithms data structures design interconnect prediction layout three-dimensional circuits

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