Flip-chip routing with unified area-I/O pad assignments for package-board co-design

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Authors: Jia-Wei Fang National Taiwan University, Taipei, Taiwan and University of Illinois at Urbana-Champaign
Martin D. F. Wong University of Illinois at Urbana-Champaign
Yao-Wen Chang National Taiwan University, Taipei, Taiwan
Published in:
· Proceeding
DAC '09 Proceedings of the 46th Annual Design Automation Conference
Pages 336-339
ACM New York, NY, USA ©2009
table of contents ISBN: 978-1-60558-497-3 doi>10.1145/1629911.1630002
Flip-chip routing with unified area-I/O pad assignments for package-board co-design Published by ACM 2009 Article
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