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Thermal-driven analog placement considering device matching
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Authors:
Po-Hung Lin
National Taiwan University, Taipei, Taiwan
Hongbo Zhang
University of Illinois at Urbana-Champaign, IL
Martin D. F. Wong
University of Illinois at Urbana-Champaign, IL
Yao-Wen Chang
National Taiwan University, Taipei, Taiwan
2009 Article
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· Downloads (12 Months): 16
· Citation Count: 3
Published in:
· Proceeding
DAC '09
Proceedings of the 46th Annual Design Automation Conference
ACM
New York, NY
, USA
©2009
table of contents
ISBN: 978-1-60558-497-3
doi>
10.1145/1629911.1630064
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Tags:
algorithms
analog placement
design
design aids
reliability
thermal matching
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