Process-induced skew variation for scaled 2-D and 3-D ICs

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Authors: Hu Xu LSI-EPFL, Lausanne, Switzerland
Vasilis F. Pavlidis LSI-EPFL, Lausanne, Switzerland
Giovanni De Micheli LSI-EPFL, Lausanne, Switzerland
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· Proceeding
SLIP '10 Proceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction
Pages 17-24
ACM New York, NY, USA ©2010
table of contents ISBN: 978-1-4503-0037-7 doi>10.1145/1811100.1811107
Process-induced skew variation for scaled 2-D and 3-D ICs Published by ACM 2010 Article
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