A method to leverage pre-silicon collateral and analysis for post-silicon testing and validation

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Authors: Gary Miller Freescale Semiconductor Inc., Austin, TX
Bandana Bhattarai Freescale Semiconductor Inc., Austin, TX
Yu-Chin Hsu SpringSoft Inc., San Jose, CA
Jay Dutt SpringSoft Inc., San Jose, CA
Xi Chen SpringSoft Inc., San Jose, CA
George Bakewell SpringSoft Inc., San Jose, CA
A method to leverage pre-silicon collateral and analysis for post-silicon testing and validation Published by ACM 2011 Article
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Published in:
· Proceeding
DAC '11 Proceedings of the 48th Design Automation Conference
Pages 575-578
ACM New York, NY, USA ©2011
table of contents ISBN: 978-1-4503-0636-2 doi>10.1145/2024724.2024857

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