Reducing cross-coupling among interconnect wires in deep-submicron datapath design

Full Text: PDFPDF Buy this ArticleBuy this Article
Authors: Joon-Seo Yim DSP Group, Information Technology Lab., LG Corporate Institute of Technology, 16, Woomyeon-Dong, Seocho-Gu, Seoul, 137-140, Korea
Chong-Min Kyung Department of Electrical Engineering, KAIST, 373-1, Kusong-Dong, Yusong-Gu, Taejon, 305-701, Korea
Published in:
Cover Image
 
· Proceeding
DAC '99 Proceedings of the 36th annual ACM/IEEE Design Automation Conference
Pages 485-490
ACM New York, NY, USA ©1999
table of contents ISBN:1-58113-109-7 doi>10.1145/309847.309984
Reducing cross-coupling among interconnect wires in deep-submicron datapath design Published by ACM 1999 Article
Bibliometrics Data  Bibliometrics
· Downloads (6 Weeks): 2
· Downloads (12 Months): 15
· Downloads (cumulative): 390
· Citation Count: 25


Tools and Resources

Share:

|
feedback Feedback | Switch to single page view (no tabs)

Powered by The ACM Guide to Computing Literature


The ACM Digital Library is published by the Association for Computing Machinery. Copyright © 2013 ACM, Inc.
Terms of Usage   Privacy Policy   Code of Ethics   Contact Us

Useful downloads: Adobe Acrobat    QuickTime    Windows Media Player    Real Player
The ACM Guide to Computing Literature
All Tags
Export Formats
 
 
Save to Binder