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Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology
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Authors:
Michael X. Wang
Department of Computer Engineering, University of California, Santa Cruz, CA
Katsuharu Suzuki
Department of Computer Engineering, University of California, Santa Cruz, CA
Wayne W.-M. Dai
Department of Computer Engineering, University of California, Santa Cruz, CA
Yee L. Low
Bell laboratories, Lucent Technologies, Murray Hill, NJ
Kevin J. O'conner
Bell laboratories, Lucent Technologies, Murray Hill, NJ
King L. Tai
Bell laboratories, Lucent Technologies, Murray Hill, NJ
2000 Article
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Published in:
· Proceeding
ASP-DAC '00 Proceedings of the 2000 Asia and South Pacific Design Automation Conference
Pages 205-210
ACM
New York, NY
, USA
©2000
table of contents
ISBN:0-7803-5974-7
doi>
10.1145/368434.368606
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