Global interconnect trade-off for technology over memory modules to application level: case study

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Authors:	A. Papanikolaou	IMEC, Kapeldreef, Leuven, Belgium
	M. Miranda	IMEC, Kapeldreef, Leuven, Belgium
	F. Catthoor	IMEC, Kapeldreef, Leuven, Belgium and Katholieke Universiteit Leuven, Belgium
	H. Corporaal	IMEC, Kapeldreef, Leuven, Belgium and Technical University of Eindhoven, The Netherlands
	H. De Man	IMEC, Kapeldreef, Leuven, Belgium and Katholieke Universiteit Leuven, Belgium
	D. De Roest	IMEC, Kapeldreef, Leuven, Belgium
	M. Stucchi	IMEC, Kapeldreef, Leuven, Belgium
	Karen Maex	IMEC, Kapeldreef, Leuven, Belgium and Katholieke Universiteit Leuven, Belgium

	2003 Article
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	· Proceeding
	SLIP '03 Proceedings of the 2003 international workshop on System-level interconnect prediction
	Pages 125 - 132 ACM New York, NY, USA ©2003 table of contents ISBN:1-58113-627-7 doi>10.1145/639929.639954

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