Shaping interconnect for uniform current density

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Authors: Muzhou Shao University of Texas at Austin, Austin, TX
D. F. Wong University of Illinois at Urbana-Champaign, Urbana, IL
Youxin Gao Synopsys, Inc., Mountain View, CA
Li-Pen Yuan Synopsys, Inc., Mountain View, CA
Huijing Cao Motorola, Inc., Xiqing EDA, Tianjin, China
Shaping interconnect for uniform current density Published by ACM 2002 Article
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ICCAD '02 Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
Pages 254-259
ACM New York, NY, USA ©2002
table of contents ISBN:0-7803-7607-2 doi>10.1145/774572.774610

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