ABSTRACT
Temperature is a dominant factor in the performance, reliability, and leakage power consumption of modern processors. As a result, increasing numbers of researchers evaluate thermal characteristics in their proposals. In this paper, we measure a real processor focusing on its thermal characterization executing diverse workloads.
Our results show that in real designs, thermal transients operate at larger scales than their performance and power counterparts. Conventional thermal simulation methodologies based on profile-based simulation or statistical sampling, such as Simpoint, tend to explore very limited execution spans. Short simulation times can lead to reduced matchings between performance and thermal phases. To illustrate these issues we characterize and classify from a thermal standpoint SPEC00 and SPEC06 applications, which are traditionally used in the evaluation of architectural proposals. This paper concludes with a list of recommendations regarding thermal modeling considerations based on our experimental insights.
- R. M. Averill, K. G. Barkley, M. A. Bowen, P. J. Camporese, A. H. Dansky, R. F. Hatch, D. E. Hoffman, M. D. Mayo, S. A. McCabe, T. G. McNamara, T. J. McPherson, G. A. Northrop, L. Sigal, H. H. Smith, D. A. Webber, and P. M. Williams. Chip integration Methodology for the IBM S/390 G5 and G6 Custom Microprocessor. In IBM Jornal of Research and Development, pages 681--706, Sep 1999. Google Scholar
Digital Library
- D. Brooks, V. Tiwari, and M. Martonosi. Wattch: a Framework for Architectural-Level Power Analysis and Optimizations. In Proceedings of the 27th annual International Symposium on Computer Architecture (ISCA), pages 83--94, Jun 2000. Google Scholar
Digital Library
- A. Coskun, R. Strong, D. Tullsen, and T. Rosing. Evaluating the impact of job scheduling and power management on processor lifetime for chip multiprocessors. In Proceeding of the 11th International joint Conference on Measurement and Modeling of Computer Systems (SIGMETRICS), pages 169--180, Jun 2009. Google Scholar
Digital Library
- B. Curran, E. Fluhr, J. Paredes, L. Sigal, J. Friedrich, Y.-H. Chan, and C. Hwang. Power-constrained high-frequency circuits for the IBM POWER6 microprocessor. IBM J. Res. Dev., 51(6):715--731, 2007. Google Scholar
Digital Library
- A. Dhodapkar and J. Smith. Comparing Program Phase Detection Techniques. In Proceedings of the 36th annual IEEE/ACM International Symposium on Microarchitecture (MICRO), pages 217--228, Dec 2003. Google Scholar
Digital Library
- H. Hamann, J. Lacey, A. Weger, and J. Wakil. Spatially-resolved imaging of microprocessor power (SIMP): hotspots in microprocessors. In Thermal and Thermomechanical Phenomena in Electronics Systems, pages 121--125, May 2006.Google Scholar
Cross Ref
- S. Heo, K. Barr, and K. Asanović. Reducing power density through activity migration. In Proceedings of the 2003 International Symposium on Low power electronics and design (ISLPED), pages 217--222, Aug 2003. Google Scholar
Digital Library
- W. Huang, M. Stant, K. Sankaranarayanan, R. Ribando, and K. Skadron. Many-core design from a thermal perspective. In Proceedings of the 45th annual conference on Design Automation (DAC), pages 746--749, Jun 2008. Google Scholar
Digital Library
- W. Huang, K. Skadron, S. Gurumurthi, R. Ribando, and M. Stan. Differentiating the roles of IR measurement and simulation for power and temperature-aware design. In Proceedings of the 2009 International Symposium on Performance Analysis of Systems and Software (ISPASS), pages 1--10, Apr 2009.Google Scholar
Cross Ref
- C. Isci and M. Martonosi. Phase Characterization for Power: Evaluating Control-Flow-Based and Event-Counter-Based Techniques. In Proceedings of the 12th International Symposium on High-Performance Computer Architecture (HPCA), pages 121--132, Jan 2006.Google Scholar
Cross Ref
- S. Jarp, R. Jurga, and A. Nowak. Perfmon2: a leap forward in performance monitoring. J. Phys.: Conf. Ser., 119:042017, 2008.Google Scholar
Cross Ref
- E. K.Ardestani, F. Mesa-Martínez, and J. Renau. Cooling Solutions for Processor Infrared Thermography. In Proceeding of 26th Annual Thermal Measurement, Modeling and Management Symposium (SEMI-THERM), Feb 2010.Google Scholar
- B. Lee and T. Kim. Optimal allocation and placement of thermal sensors for reconfigurable systems and its practical extension. In Proceedings of the 13th Asia and South Pacific Design Automation Conference(ASP-DAC), pages 703--707, Jan 2008. Google Scholar
Digital Library
- W. Liu, X. Jin, J. Chen, M.-C. Jeng, Z. Liu, Y. Cheng, K. Chen, M. Chan, K. Hui, J. Huang, R. Tu, P. Ko, and C. Hu. BSIM 3v3.2 MOSFET Model Users' Manual. Technical Report UCB/ERL M98/51, EECS Department, University of California, Berkeley, 1998. URL http://www.eecs.berkeley.edu/Pubs/TechRpts/1998/3486.html.Google Scholar
- F. Mesa-Martínez, J. Nayfach-Battilana, and J. Renau. Power model validation through thermal measurements. In Proceedings of the 34th annual International Symposium on Computer architecture (ISCA), pages 302--311, Jun 2007. Google Scholar
Digital Library
- H. D. Mogal and K. Bazargan. Thermal-aware floorplanning for task migration enabled active sub-threshold leakage reduction. In Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pages 302--305, Nov 2008. Google Scholar
Digital Library
- R. Mukherjee and S. Memik. Systematic temperature sensor allocation and placement for microprocessors. In Proceedings of the 43rd annual conference on Design automation (DAC), pages 542--547, Jul 2006. Google Scholar
Digital Library
- R. Mukherjee, S. Mondal, and S. Memik. Thermal sensor allocation and placement for reconfigurable systems. In Proceedings of the 2006 IEEE/ACM International Conference on Computer-aided design ICCAD), pages 437--442, Nov 2006. Google Scholar
Digital Library
- N. Nethercote and J. Seward. Valgrind: a framework for heavyweight dynamic binary instrumentation. SIGPLAN Not., 42(6):89--100, Jun 2007. Google Scholar
Digital Library
- V. Nookala, D. Lilja, and S. Sapatnekar. Temperature-aware floorplanning of microarchitecture blocks with ipc-power dependence modeling and transient analysis. In Proceedings of the 2006 International Symposium on Low Power Electronics and Design (ISLPED), pages 298--303, Oct 2006. Google Scholar
Digital Library
- A. Phansalkar, A. Joshi, L. Eeckhout, and L. John. Measuring program similarity: Experiments with SPEC CPU benchmark suites. In Proceedings of the 2005 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS), pages 10--20, Mar 2005. Google Scholar
Digital Library
- A. Phansalkar, A. Joshi, and L. John. Analysis of redundancy and application balance in the SPEC CPU2006 benchmark suite. In Proceedings of the 34th annual International Symposium on Computer architecture (ISCA), pages 412--423, Jun 2007. Google Scholar
Digital Library
- K. Rangan, G.-Y. Wei, and D. Brooks. Thread motion: fine-grained power management for multi-core systems. SIGARCH Comput. Archit. News, 37(3):302--313, 2009. Google Scholar
Digital Library
- T. Sherwood, E. Perelman, G. Hamerly, and B. Calder. Automatically characterizing large scale program behavior. In Proceedings of the 10th international conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS), volume 30, pages 45--57, Oct 2002. Google Scholar
Digital Library
- T. Sherwood, S. Sair, and B. Calder. Phase tracking and prediction. In Proceedings of the 30th annual International Symposium on Computer architecture (ISCA), pages 336--349, Jun 2003. Google Scholar
Digital Library
- K. Skadron, M. R. Stan, W. Huang, S. Velusamy, K. Sankaranarayanan, and D. Tarjan. Temperature-Aware Microarchitecture. In Proceedings of the 30th Annual International Symposium on Computer Architecture (ISCA), pages 2--13, Jun 2003. Google Scholar
Digital Library
- J. Srinivasan, A. Sarita, P. Bose, and R. Jude. Lifetime reliability: toward an architectural solution. In IEEE MICRO, volume 25, pages 70--80, 2005. Google Scholar
Digital Library
- Y. Wu and C. Yang. Joint exploration of architectural and physical design spaces with thermal consideration. In Proceedings of the 2005 International Symposium on Low power electronics and design (ISLPED), pages 123--126, Aug 2005. Google Scholar
Digital Library
Index Terms
Characterizing processor thermal behavior
Recommendations
Characterizing processor thermal behavior
ASPLOS '10Temperature is a dominant factor in the performance, reliability, and leakage power consumption of modern processors. As a result, increasing numbers of researchers evaluate thermal characteristics in their proposals. In this paper, we measure a real ...
Characterizing processor thermal behavior
ASPLOS '10Temperature is a dominant factor in the performance, reliability, and leakage power consumption of modern processors. As a result, increasing numbers of researchers evaluate thermal characteristics in their proposals. In this paper, we measure a real ...
Temperature and supply Voltage aware performance and power modeling at microarchitecture level
Performance and power are two primary design issues for systems ranging from server computers to handhelds. Performance is affected by both temperature and supply voltage because of the temperature and voltage dependence of circuit delay. Furthermore, ...








Comments