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Predictability for timing and temperature in multiprocessor system-on-chip platforms

Published:21 March 2013Publication History
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Abstract

High computational performance in multiprocessor system-on-chips (MPSoCs) is constrained by the ever-increasing power densities in integrated circuits, so that nowadays MPSoCs face various thermal issues. For instance, high chip temperatures may lead to long-term reliability concerns and short-term functional errors. Therefore, the new challenge in designing embedded real-time MPSoCs is to guarantee the final performance and correct function of the system, considering both functional and non-functional properties. One way to achieve this is by ruling out mapping alternatives that do not fulfill requirements on performance or peak temperature already in early design stages. In this article, we propose a thermal-aware optimization framework for mapping real-time applications onto MPSoC platforms. The performance and temperature of mapping candidates are evaluated by formal temporal and thermal analysis models. To this end, analysis models are automatically generated during design space exploration, based on the same specifications as used for software synthesis. The analysis models are automatically calibrated with performance data reflecting the execution of the system on the target platform. The data is automatically obtained prior to design space exploration based on a set of benchmark mappings. Case studies show that the performance and temperature requirements are often conflicting goals and optimizing them together leads to major benefits in terms of a guaranteed and predictable high performance.

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            • Published in

              cover image ACM Transactions on Embedded Computing Systems
              ACM Transactions on Embedded Computing Systems  Volume 12, Issue 1s
              Special section on ESTIMedia'12, LCTES'11, rigorous embedded systems design, and multiprocessor system-on-chip for cyber-physical systems
              March 2013
              701 pages
              ISSN:1539-9087
              EISSN:1558-3465
              DOI:10.1145/2435227
              Issue’s Table of Contents

              Copyright © 2013 ACM

              Publisher

              Association for Computing Machinery

              New York, NY, United States

              Publication History

              • Published: 21 March 2013
              • Accepted: 1 June 2012
              • Revised: 1 March 2012
              • Received: 1 November 2011
              Published in tecs Volume 12, Issue 1s

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