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Throughput maximization for periodic real-time systems under the maximal temperature constraint

Published:27 January 2014Publication History
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Abstract

In this article, we study the problem of how to maximize the throughput of a periodic real-time system under a given peak temperature constraint. We assume that different tasks in our system may have different power and thermal characteristics. Two scheduling approaches are presented. The first is built upon processors that can be in either active or sleep mode. By judiciously selecting tasks with different thermal characteristics as well as alternating the processor's active/sleep mode, the sleep period required to cool down the processor is kept at a minimum level, and, as the result, the throughput is maximized. We further extend this approach for processors with dynamic voltage/frequency scaling (DVFS) capability. Our experiments on a large number of synthetic test cases as well as real benchmark programs show that the proposed methods not only consistently outperform the existing approaches in terms of throughput maximization, but also significantly improve the feasibility of tasks when a more stringent temperature constraint is imposed.

References

  1. N. Bansal, T. Kimbrel, and K. Pruhs. 2007. Speed scaling to manage energy and temperature. J. ACM 54, 1, 1--39. Google ScholarGoogle ScholarDigital LibraryDigital Library
  2. M. Bao, A. Andrei, P. Eles, and Z. Peng. 2009. On-line thermal aware dynamic voltage scaling for energy optimization with frequency/temperature dependency consideration. In Proceedings of the Design Automation Conference. 490--495. Google ScholarGoogle ScholarDigital LibraryDigital Library
  3. M. Bao, A. Andrei, P. Eles, and Z. Peng. 2010. Temperature-aware idle time distribution for energy optimization with dynamic voltage scaling. In Proceedings of the Design Automation & Test in Europe (DATE). 21--27. Google ScholarGoogle ScholarDigital LibraryDigital Library
  4. D. Brooks and M. Martonosi. 2001. Dynamic thermal management for high-performance microprocessors. In Proceedings of the 7th International Symposium on High-Performance Computer Architecture (HPCA'01). 171. Google ScholarGoogle ScholarDigital LibraryDigital Library
  5. D. Brooks, V. Tiwari, and M. Martonosi. 2000. Wattch: A framework for architectural-level power analysis and optimizations. In Proceedings of the 27th International Symposium on Computer Architecture (ISCA). 83--94. Google ScholarGoogle ScholarDigital LibraryDigital Library
  6. T. Chantem, X. S. Hu, and R. Dick. 2009. Online work maximization under a peak temperature constraint. In Proceedings of the International Symposium on Low Power Electronics and Design (ISLPED). 105--110. Google ScholarGoogle ScholarDigital LibraryDigital Library
  7. V. Chaturvedi, H. Huang, and G. Quan. 2010. Leakage aware scheduling on maximal temperature minimization for periodic hard real-time systems. In Proceedings of the 10th IEEE International Conference on Computer and Information Technology. 1802--1809. Google ScholarGoogle ScholarDigital LibraryDigital Library
  8. J.-J. Chen, H.-R. Hsu, and T.-W. Kuo. 2006. Leakage-aware energy-efficient scheduling of real-time tasks in multiprocessor systems. In Proceedings of the IEEE Real-Time and Embedded Technology and Application Symposium (RTAS). 408--417. Google ScholarGoogle ScholarDigital LibraryDigital Library
  9. A. Coskun, J. Ayala, D. Atienza, T. Rosing, and Y. Leblebici. 2009. Dynamic thermal management in 3D multicore architectures. In Proceedings of the Design, Automation & Test in Europe (DATE'09). 1410--1415. Google ScholarGoogle ScholarDigital LibraryDigital Library
  10. V. Hanumaiah, R. Rao, S. Vrudhula, and K. S. Chatha. 2009a. Throughput optimal task allocation under thermal constraints for multi-core processors. In Proceedings of the Design Automation Conference (DAC'09). ACM, New York, NY, 776--781. Google ScholarGoogle ScholarDigital LibraryDigital Library
  11. V. Hanumaiah, S. Vrudhula, and K. Chatha. 2009b. Maximizing performance of thermally constrained multi-core processors by dynamic voltage and frequency control. In Proceedings of the IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers, (ICCAD'09). 310--313. Google ScholarGoogle ScholarDigital LibraryDigital Library
  12. HotSpot. 2009. HotSpot 4.2 temperature modeling tool. University of Virgina. http://lava.cs.virginia.edu/HotSpot.Google ScholarGoogle Scholar
  13. H. Huang and G. Quan. 2011. Leakage aware energy minimization for real-time systems under the maximum temperature constraint. In Proceedings of the Design Automation & Test in Europe (DATE).Google ScholarGoogle Scholar
  14. H. Huang, G. Quan, and J. Fan. 2010. Leakage temperature dependency modeling in system level analysis. In Proceedings of the 11th International Symposium on Quality of Electronic Design (ISQED). 447--452.Google ScholarGoogle Scholar
  15. R. Jayaseelan and T. Mitra. 2008. Temperature aware task sequencing and voltage scaling. In Proceedings of the International Conference on Computer-Aided Design (ICCAD). 618--623. Google ScholarGoogle ScholarDigital LibraryDigital Library
  16. J. Li, M. Qiu, J. Niu, L. Yang, Y. Zhu, and Z. Ming. 2013. Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads. ACM Trans. Embed. Comput. Syst. 12, 1--22. Google ScholarGoogle ScholarDigital LibraryDigital Library
  17. W. Liao, L. He, and K. Lepak. 2005. Temperature and supply voltage aware performance and power modeling at microarchitecture level. IEEE Trans. Comput.-Aid. Des. Integr. Circuits Syst. 24, 7, 1042--1053. Google ScholarGoogle ScholarDigital LibraryDigital Library
  18. S. Liu, M. Qiu, W. Gao, X.-J. Tang, and B. Guo. 2010a. Hybrid of job sequencing and DVFS for peak temperature reduction with nondeterministic applications. In Proceedings of the 10th International Conference on Computer and Information Technology. 1780--1787. Google ScholarGoogle ScholarDigital LibraryDigital Library
  19. S. Liu, J. Zhang, Q. Wu, and Q. Qiu. 2010b. Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor. In Proceedings of the 11th International Symposium on Quality Electronic Design (ISQED). 390--398.Google ScholarGoogle Scholar
  20. Y. Liu and H. Yang. 2010. Temperature-aware leakage estimation using piecewise linear power models. IEICE Trans. Electron. 93, 12, 1679--1691.Google ScholarGoogle ScholarCross RefCross Ref
  21. Y. Liu, H. Yang, R. P. Dick, H. Wang, and L. Shang. 2007. Thermal vs. energy optimization for DVFS-enabled processors in embedded systems. In Proceedings of the International Symposium on Quality Electronic Design (ISQED). 204--209. Google ScholarGoogle ScholarDigital LibraryDigital Library
  22. C.-L. Lung, Y.-L. Ho, D.-M. Kwai, and S.-C. Chang. 2011. Thermal-aware on-line task allocation for 3D multi-core processor throughput optimization. In Proceedings of the Design, Automation & Test in Europe (DATE). 1--6.Google ScholarGoogle Scholar
  23. MediaBench. 1997. Mediabench. http://euler.slu.edu/∼fritts/mediabench/.Google ScholarGoogle Scholar
  24. M. D. Powell, M. Gomaa, and T. N. Vijaykumar. 2004. Heat-and-run: Leveraging SMT and CMP to manage power density through the operating system. In Proceedings of the International Conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS). 260--270. Google ScholarGoogle ScholarDigital LibraryDigital Library
  25. M. Qiu and E. H.-M. Sha. 2013. Cost minimization while satisfying hard/soft timing constraints for heterogeneous embedded systems. ACM Trans. Des. Autom. Electron. Syst. 14, 1--30. Google ScholarGoogle ScholarDigital LibraryDigital Library
  26. G. Quan and V. Chaturvedi. 2010. Feasibility analysis for temperature-constraint hard real-time periodic tasks. IEEE Trans. Indus. Info. 6, 3, 329--339.Google ScholarGoogle ScholarCross RefCross Ref
  27. G. Quan and Y. Zhang. 2009. Leakage aware feasibility analysis for temperature-constrained hard real-time periodic tasks. In Proceedings of the 21st Euromicro Conference on Real-Time System (ECRTS). 207--216. Google ScholarGoogle ScholarDigital LibraryDigital Library
  28. G. Quan, Y. Zhang, W. Wiles, and P. Pei. 2008. Guaranteed scheduling for repetitive hard real-time tasks under the maximal temperature constraint. In Proceedings of the 6th International Conference on Hardware/Software Codesign and System Synthesis (ISSS+CODES). Google ScholarGoogle ScholarDigital LibraryDigital Library
  29. M. Santarini. 2005. Thermal integrity: A must for low-power-IC digital design. EDN.Google ScholarGoogle Scholar
  30. Simplescalar. 2004. Simplescalar. http://www.simplescalar.com.Google ScholarGoogle Scholar
  31. K. Skadron, M. Stan, W. Huang, S. Velusamy, K. Sankaranarayanan, and D. Tarjan. 2003. Temperature-aware microarchitecture. In Proceedings of the 30th International Symposium on Computer Architecture (ICSA), 2--13. Google ScholarGoogle ScholarDigital LibraryDigital Library
  32. SPEC. 2000. Spec2000 benchmarks. http://www.spec.org.Google ScholarGoogle Scholar
  33. C. Sun, L. Shang, and R. Dick. 2007. Three-dimensional multiprocessor system-on-chip thermal optimization. In Proceedings of the 5th IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS). 117--122. Google ScholarGoogle ScholarDigital LibraryDigital Library
  34. S. Wang and R. Bettati. 2006. Reactive speed control in temperature-constrained real-time systems. In Proceedings of the 18th Euromicro Conference on Real-Time System (ECRTS). 161--170. Google ScholarGoogle ScholarDigital LibraryDigital Library
  35. Wikipedia. 2013. L'hopital's rule, http://en.wikipedia.org/wiki/l'hopital's-rule.Google ScholarGoogle Scholar
  36. C.-Y. Yang, J.-J. Chen, L. Thiele, and T.-W. Kuo. 2010. Energy-efficient real-time task scheduling with temperature-dependent leakage. In Proceedings of the Design Automation & Test in Europe (DATE). 9--14. Google ScholarGoogle ScholarDigital LibraryDigital Library
  37. L.-T. Yeh and R. C. Chu. 2002. Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices. ASME Press, New York, NY.Google ScholarGoogle Scholar
  38. S. Zhang and K. S. Chatha. 2007. Approximation algorithm for the temperature-aware scheduling problem. In Proceedings of the International Conference on Computer-Aided Design (ICCAD). 281--288. Google ScholarGoogle ScholarDigital LibraryDigital Library
  39. S. Zhang and K. S. Chatha. 2010. Thermal aware task sequencing on embedded processors. In Proceedings of the Design Automation Conference (DAC). 585--590. Google ScholarGoogle ScholarDigital LibraryDigital Library
  40. X. Zhou, Y. Xu, Y. Du, Y. Zhang, and J. Yang. 2008. Thermal management for 3D processors via task scheduling. In Proceedings of the International Conference on Parallel Processing (ICPP). 115--122. Google ScholarGoogle ScholarDigital LibraryDigital Library
  41. C. Zhu, Z. Gu, L. Shang, R. Dick, and R. Joseph. 2008. Three-dimensional chip-multiprocessor run-time thermal management. IEEE Trans. Comput.-Aid. Des. Integr. Circuits Syst. 27, 8, 1479--1492. Google ScholarGoogle ScholarDigital LibraryDigital Library

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