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Plug&Chip: A Framework for Supporting Rapid Prototyping of 3D Hybrid Virtual SoCs

Published:15 December 2014Publication History
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Abstract

In the embedded system domain there is a continuous demand towards providing higher flexibility for application development. This trend strives for virtual prototyping solutions capable of performing fast system simulation. Among other benefits, such a solution supports concurrent hardware/software system design by enabling to start developing, testing, and validating the embedded software substantially earlier than has been possible in the past. Towards this direction, throughout this article we introduce a new framework, named Plug&Chip, targeting to support rapid prototyping of 2D and 3D digital systems. In contrast to other relevant approaches, our solution provides higher flexibility by enabling incremental system design, while also handling platforms developed with the usage of 3D integration technology.

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        • Published in

          cover image ACM Transactions on Embedded Computing Systems
          ACM Transactions on Embedded Computing Systems  Volume 13, Issue 5s
          Special Issue on Risk and Trust in Embedded Critical Systems, Special Issue on Real-Time, Embedded and Cyber-Physical Systems, Special Issue on Virtual Prototyping of Parallel and Embedded Systems (ViPES)
          November 2014
          501 pages
          ISSN:1539-9087
          EISSN:1558-3465
          DOI:10.1145/2660459
          Issue’s Table of Contents

          Copyright © 2014 ACM

          Publisher

          Association for Computing Machinery

          New York, NY, United States

          Publication History

          • Published: 15 December 2014
          • Accepted: 1 August 2014
          • Revised: 1 January 2014
          • Received: 1 June 2013
          Published in tecs Volume 13, Issue 5s

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