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Integrated Through-Silicon Via Placement and Application Mapping for 3D Mesh-Based NoC Design

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Published:03 November 2016Publication History
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Abstract

This article proposes a solution to the integrated problem of Through-Silicon Via (TSV) placement and mapping of cores to the routers in a three-dimensional mesh-based Network-on-Chip (NoC) system. TSV geometry restricts their number in three-dimensional (3D) ICs. As a result, only about 25% of routers in a 3D NoC can possess vertical connections. Mapping plays an important role in evolving good system solutions in such a situation. TSVs have been placed with detailed consultation with the application mapping process. The integrated problem was first solved using the exact method of Integer Liner Programming (ILP). Next, a solution was obtained via a Particle Swarm Optimization (PSO) formulation. Several augmentations to the basic PSO strategy have been proposed to generate good-quality solutions. The results obtained are better than many of the contemporary approaches and close to the theoretical situation in which all routers are 3D in nature.

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  1. Integrated Through-Silicon Via Placement and Application Mapping for 3D Mesh-Based NoC Design

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