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On The Design and Application of Thermal Isolation Servers

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Published:27 September 2017Publication History
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Abstract

Recently, there has been an increasing trend towards executing real-time applications on multi-core platforms. However, this complicates the design problem, as applications running on different cores can interfere due to shared resources and mediums. In this paper, we focus on thermal interference, where a given task (τ 1) heats the processor, resulting in reduced service (due to Dynamic Thermal Management (DTM)) to another task (τ2). In real-time domain, where tasks have deadline constraints, thermal interference is a substantial problem as it directly impacts the Worst Case Execution Time (WCET) of the effected application (τ2). The problem exacerbates as we move to mixed-criticality systems, where the criticality of τ2 may be greater than the criticality of τ1, complicating the certification process.

In this paper, we propose a server based strategy (Thermal Isolation Server (TI Server)) which can be used to avoid thermal interference of applications. We also present a heuristic to design TI Servers to meet the timing constraints of all tasks and the thermal constraints of the system. TI Servers are time/space composable, and can be applied to a variety of task models. We also evaluate TI Servers on a hardware test-bed for validation purposes.

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            • Published in

              cover image ACM Transactions on Embedded Computing Systems
              ACM Transactions on Embedded Computing Systems  Volume 16, Issue 5s
              Special Issue ESWEEK 2017, CASES 2017, CODES + ISSS 2017 and EMSOFT 2017
              October 2017
              1448 pages
              ISSN:1539-9087
              EISSN:1558-3465
              DOI:10.1145/3145508
              Issue’s Table of Contents

              Copyright © 2017 Owner/Author

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              Association for Computing Machinery

              New York, NY, United States

              Publication History

              • Published: 27 September 2017
              • Accepted: 1 July 2017
              • Revised: 1 June 2017
              • Received: 1 April 2017
              Published in tecs Volume 16, Issue 5s

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