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Diagonal Component Expansion for Flow-Layer Placement of Flow-Based Microfluidic Biochips

Published:27 September 2017Publication History
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Abstract

Continuous flow-based microfluidic devices have seen a huge increase in interest because of their ability to automate and miniaturize biochemistry and biological processes, as well as their promise of creating a programmable platform for chemical and biological experimentation. The major hurdle in the adoption of these types of devices is in the design, which is largely done by hand using tools such as AutoCAD or SolidWorks, which require immense domain knowledge and are hard to scale. This paper investigates the problem of automated physical design for continuous flow-based microfluidic very large scale integration (mVLSI) biochips, starting from a netlist specification of the flow layer. After an initial planar graph embedding, vertices in the netlist are expanded into two-dimensional components, followed by fluid channel routing. A new heuristic, DIagonal Component Expansion (DICE) is introduced for the component expansion step. Compared to a baseline expansion method, DICE improves area utilization by a factor of 8.90x and reduces average fluid routing channel length by 47.4%.

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              • Published in

                cover image ACM Transactions on Embedded Computing Systems
                ACM Transactions on Embedded Computing Systems  Volume 16, Issue 5s
                Special Issue ESWEEK 2017, CASES 2017, CODES + ISSS 2017 and EMSOFT 2017
                October 2017
                1448 pages
                ISSN:1539-9087
                EISSN:1558-3465
                DOI:10.1145/3145508
                Issue’s Table of Contents

                Copyright © 2017 ACM

                Publisher

                Association for Computing Machinery

                New York, NY, United States

                Publication History

                • Published: 27 September 2017
                • Revised: 1 June 2017
                • Accepted: 1 June 2017
                • Received: 1 March 2017
                Published in tecs Volume 16, Issue 5s

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