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abstract

Demonstrating poimo as Inflatable, Inclusive Mobility Devices with a Soft Input Interface

Published:25 July 2022Publication History

ABSTRACT

In this demo, we showcase poimo, a series of POrtable and Inflatable MObility devices made of a balloon-like soft material called drop-stitch fabric. Poimo has two merits: (1) inflatability of a soft and lightweight body allowing users to deflate and carry it on a small scale and (2) inclusiveness enabling made-to-order design and fabrication of mobility devices for each user. As an alternative way to conventional rigid controllers, we also introduce a soft and deformable input interface to navigate a sofa-type poimo. Finally, we report two types of field studies: public users riding on two types of poimos on a flat paved road, and the authors riding on a sofa-type poimo in a traditional European environment with inclined stone-paved streets.

References

  1. Ryuma Niiyama, Hiroki Sato, Kazzmasa Tsujimura, Koya Narumi, Young ah Seong, Ryosuke Yamamura, Yasuaki Kakehi, and Yoshihiro Kawahara. 2020. Poimo: Portable and Inflatable Mobility Devices Customizable for Personal Physical Characteristics. Association for Computing Machinery, New York, NY, USA, 912–923. https://doi.org/10.1145/3379337.3415894Google ScholarGoogle ScholarDigital LibraryDigital Library
  2. Hiroki Sato, Young ah Seong, Ryosuke Yamamura, Hiromasa Hayashi, Katsuhiro Hata, Hisato Ogata, Ryuma Niiyama, and Yoshihiro Kawahara. 2020. Soft yet Strong Inflatable Structures for a Foldable and Portable Mobility. In Extended Abstracts of the 2020 CHI Conference on Human Factors in Computing Systems(Honolulu, HI, USA) (CHI EA ’20). Association for Computing Machinery, New York, NY, USA, 1–4. https://doi.org/10.1145/3334480.3383147Google ScholarGoogle ScholarDigital LibraryDigital Library
  3. Keisuke Watanabe, Ryosuke Yamamura, and Yasuaki Kakehi. 2021. Foamin: A Deformable Sensor for Multimodal Inputs Based on Conductive Foam with a Single Wire. In Extended Abstracts of the 2021 CHI Conference on Human Factors in Computing Systems (Yokohama, Japan) (CHI EA ’21). Association for Computing Machinery, New York, NY, USA, Article 189, 4 pages. https://doi.org/10.1145/3411763.3451547Google ScholarGoogle ScholarDigital LibraryDigital Library

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  • Published in

    cover image ACM Conferences
    SIGGRAPH '22: ACM SIGGRAPH 2022 Emerging Technologies
    July 2022
    23 pages
    ISBN:9781450393638
    DOI:10.1145/3532721

    Copyright © 2022 Owner/Author

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    Association for Computing Machinery

    New York, NY, United States

    Publication History

    • Published: 25 July 2022

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