
Index Terms
M.S. program with specialization in computers: department of electrical engineering
Recommendations
Study of direct Cu electrodeposition on ultra-thin Mo for copper interconnect
Direct electrodeposition (ECD) process of copper film on ultra-thin molybdenum film is investigated in both copper sulfate - sulfuric acid (CuSO4 - H2SO4) acidic bath and copper sulfate - ethylenediamine (CuSO4 - En) neutral bath (pH=7.5). The neutral ...
Electroless Co(Mo,P) films for Cu interconnect application
Thin cobalt-molybdenum-phosphorous, Co(Mo,P), films, prepared by electroless deposition, have been studied for barrier and capping layers for copper metallization for ULSI applications. The solutions and the deposition conditions for the preparation of ...
Initial reactions in Ti-Si(Mo) bilayers
In situ resistance measurements were used to investigate the initial reactions between a titanium film and a molybdenum-doped silicon film. MeV4He+ Rutherford spectrometry and X-ray diffraction were also used. An X-ray amorphous layer having the ...






Comments